发明名称 |
MASK MANAGEMENT SYSTEM AND METHOD FOR OLED ENCAPSULATION |
摘要 |
A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate. |
申请公布号 |
US2014170785(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201214126211 |
申请日期 |
2012.06.18 |
申请人 |
Kurita Shinichi;Kim Beom Soo |
发明人 |
Kurita Shinichi;Kim Beom Soo |
分类号 |
H01L51/56 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
1. A method of encapsulating an organic light-emitting diode (OLED) device, comprising:
positioning a first mask over a substrate, the first mask having a first size; depositing a first encapsulating layer on an OLED device disposed on the substrate with the first mask; positioning a second mask over the substrate, the second mask having a second size; depositing a buffer layer on the first encapsulating layer and the OLED device with the second mask; positioning a third mask over the substrate, the third mask having a size equal to the first size; and depositing a second encapsulating layer on the buffer layer, the first encapsulating layer, and the OLED device with the first mask.
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地址 |
San Jose CA US |