| 主权项 |
1. A semiconductor device, comprising:
a control terminal attached to a patterned insulating substrate; a first projection formed on the control terminal; a second projection formed on the control terminal away from the first projection; a concave formed between the first projection and the second projection; a resin case disposed to cover the patterned insulating substrate, and having an opening for passing the control terminal therethrough; a first concave portion formed on a sidewall of the opening of the resin case; a beam portion disposed at a bottom portion of the opening of the resin case; a second concave portion formed in the beam portion; a resin block inserted into the opening of the resin case and sandwiching the control terminal together with the sidewall of the opening of the resin case to fix the control terminal to the resin case; a convex step portion formed in the resin block to fit into the concave of the control terminal; a third projection formed on a side surface of the resin block to fit into the first concave portion; and a fourth projection formed on a bottom surface of the resin block to fit into the second concave portion.
|
