| 发明名称 |
EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME |
| 摘要 |
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN). |
| 申请公布号 |
WO2014092403(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
WO2013KR11314 |
申请日期 |
2013.12.06 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
YUN, SUNGJIN;PARK, JAE MAN;YOON, JONG HEUM;HAN, YOUNG JU |
| 分类号 |
C08L63/00;C08G59/22;C08K3/38;H05K1/03 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
