CARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

A carrier structure (210) and a method (300) of manufacturing a carrier structure are provided. The carrier structure comprises a carrier substrate (230) and a heat sink portion (240). The carrier substrate is arranged to support at least one electronic element (220), and the heat sink portion is arranged for dissipating heat from the carrier substrate. The carrier substrate is in physical contact with the heat sink portion, and the carrier substrate consists of a homogeneous material which is thermally conductive and electrically insulating.