| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding wire and a bonding ribbon which do not cause corrosion of an Al coating layer, when applying a bonding wire and a bonding ribbon, having a core material of Cu coated with Al, to a power semiconductor device.SOLUTION: Since an intermediate layer is formed between a Cu core material and an Al coating layer, and a metal having a standard oxidation-reduction potential between 0 V and -1.6 V is used for forming the intermediate layer, corrosion of the Al coating layer can be prevented. Zr, Nb, Ta, Zn, Cr, Fe, Co, Ni, Mo, Sn can be used in the intermediate layer. Preferably, the bonding wire and bonding ribbon have a cross-sectional area of 1500 square μm or more. |
