Method of Forming Substrate

摘要

A method of forming a substrate is provided, which includes steps of providing a metal plate having a first surface and a second surface; forming a plurality of recesses on the first surface of the metal plate by using laser cutting technique; filling the plurality of recesses with an insulating material; removing a part of the metal plate in a direction of from the second surface to the first surface, so that two ends of the insulating material are exposed, and a substrate body is formed by a conductor portion formed by the remaining part of the metal plate and an insulating portion formed by the insulating material; and forming a circuit layer on a first surface of the substrate body and a circuit layer on a second surface of the substrate body is provided. Thus, the two circuit layers are electrically connected by the conductor portion that also provides a heat dissipation path and are separated by the insulating portion.

主权项

1. A method of forming a substrate, comprising:
providing a metal plate having a first surface and a second surface; forming a plurality of recesses on the first surface of the metal plate by using laser cutting technique; filling the plurality of recesses with an insulating material; removing a part of the metal plate in a direction of from the second surface to the first surface, so that two ends of the insulating material are exposed, and a substrate body is formed by a conductor portion formed by a remaining part of the metal plate and an insulating portion formed by the insulating material; and forming a first circuit layer on a first surface of the substrate body and a second circuit layer on a second surface of the substrate body, wherein the first and second circuit layers are electrically connected by the conductor portion and are separated by the insulating portion.