| 发明名称 |
PASSIVE COOLING SYSTEM INTEGRATED INTO A PRINTED CIRCUIT BOARD FOR COOLING ELECTRONIC COMPONENTS |
| 摘要 |
A passive cooling system is provided for dissipating heat from an electronic component. The system includes a printed circuit board including a first dielectric layer and a first conductive layer, an electronic component coupled to the printed circuit board via a plurality of electrical contacts, and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array. |
| 申请公布号 |
US2014168903(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201213713395 |
申请日期 |
2012.12.13 |
| 申请人 |
NVIDIA CORPORATION |
发明人 |
Clay Richard Washburn |
| 分类号 |
H05K1/02;H05K9/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system comprising:
a printed circuit board including a first dielectric layer and a first conductive layer; an electronic component coupled to the printed circuit board via a plurality of electrical contacts; and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array.
|
| 地址 |
Santa Clara CA US |
