Chip Comprising a Fill Structure

摘要

A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.

主权项

1. A method of manufacturing a plurality of chips, the method comprising:
forming a dielectric layer over a substrate comprising dicing lines for singulating the substrate; forming a fill structure having a periodic structure in the dielectric layer, wherein the fill structure is disposed between regions of the substrate comprising the plurality of chips, wherein the periodic structure has a first periodicity with a first periodic pitch in a first lateral direction and having a second periodicity with a second periodic pitch in a second lateral direction perpendicular to the first lateral direction, and wherein a width of each of the dicing lines is less than 100 μm, and wherein the first periodic pitch is less than 20 μm; and singulating the substrate through the dicing lines to form the plurality of chips.