METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method of manufacturing a semiconductor chip includes forming a masking member including an opening on a wiring substrate including a chip mounting region so as to align the opening with the chip mounting region, forming an uncured sealing resin on at least the chip mounting region of the wiring substrate, wherein a support film is formed on the uncured sealing resin, removing the support film from the uncured sealing resin, removing the masking member from the wiring substrate so that the uncured sealing resin remains on the chip mounting region, and flip-chip mounting a semiconductor chip onto the chip mounting region with the uncured sealing resin arranged in between. The uncured sealing resin has a higher temperature when removing the masking member than when removing the support film.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming a masking member including an opening on a wiring substrate including a chip mounting region so as to align the opening with the chip mounting region; forming an uncured sealing resin on at least the chip mounting region of the wiring substrate, wherein a support film is formed on the uncured sealing resin; removing the support film from the uncured sealing resin; removing the masking member from the wiring substrate so that the uncured sealing resin remains on the chip mounting region; and flip-chip mounting a semiconductor chip onto the chip mounting region with the uncured sealing resin arranged in between, wherein the uncured sealing resin has a higher temperature when removing the masking member than when removing the support film.