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1. A manufacturing method of a semiconductor device, the semiconductor device including: a p-type semiconductor layer mainly made of gallium nitride (GaN); an n-type semiconductor layer mainly made of gallium nitride (GaN) and connected with the p-type semiconductor layer; a first electrode layer formed on the n-type semiconductor layer; and a second electrode layer formed on the p-type semiconductor layer, wherein the first electrode layer and the second electrode layer are electrically connected such as to each operate at an identical potential, and wherein the first electrode layer is connected with at least a part of a surface of the second electrode layer which is opposite to a surface of the second electrode layer that is in contact with the p-type semiconductor layer, the manufacturing method comprising the steps of:
forming the first electrode layer on the n-type semiconductor layer; forming the second electrode layer on the p-type semiconductor layer; and performing heat treatment for the first electrode layer and the second electrode layer formed on the semiconductor layers, wherein temperature of the heat treatment is not lower than 400 degrees centigrade and not higher than 650 degrees centigrade.
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