发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module capable of preventing concentration of thermal stress at four corners of an end surface of a thermoelectric element and enlarging an area of an electrode bonded to the end surface of the thermoelectric element.SOLUTION: A thermoelectric module 10 comprises a thermoelectric element 1 and an electrode 2. The thermoelectric element 1 includes a rectangular end surface 1a. The electrode 2 includes a first bonding part 21 bonded to a central part 11 of the end surface 1a, a second bonding part 22 bonded to one end 12, and a third bonding part 23 bonded to the other end 13. Each of the second bonding part 22 and the third bonding part 23 is arranged at intervals from each of the four corners of the end surface 1a. A bonding length 21a between the first bonding part 21 in a second direction A2 perpendicular to a first direction A1 and the end surface 1a has a longer dimension than each of a bonding length 22a between the second bonding part 22 in the second direction and the end surface 1a and a bonding length 23a between the third bonding part 23 in the second direction and the end surface 1a.
申请公布号 JP2014112587(A) 申请公布日期 2014.06.19
申请号 JP20120266182 申请日期 2012.12.05
申请人 KELK LTD 发明人 KIYOZAWA KO;KUSHIBIKI SHUNSUKE
分类号 H01L35/32;H02N11/00 主分类号 H01L35/32
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