LASER MACHINING DEVICE, MACHINING CONDITION SETTING METHOD FOR PATTERNED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a machining condition setting method capable of satisfactorily dicing a patterned substrate.SOLUTION: A machining condition setting method when irradiating laser light so that machining marks formed on a patterned substrate by unit pulsed light are discretely located along planned machining lines, and dicing the patterned substrate by crack extension machining for extending cracks from the respective machining marks, includes steps of: performing the crack extension machining on a portion of the patterned substrate as provisional machining; and identifying an offset direction of a laser beam irradiated position using a first profile obtained by integrating pixel values along a machining direction of the provisional machining on a first pick-up image obtained by imaging a provisional machining execution portion in a state of focusing on a back surface of the patterned substrate.