| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation performance from a dielectric coaxial resonator by a simple structure without providing additional components.SOLUTION: A signal processing device 11 includes: a resonator device 1; and a housing 13. The resonator device 1 includes: a PCB substrate 5; and a dielectric coaxial resonator 2A. The dielectric coaxial resonator 2A is placed on a top surface of the PCB substrate 5 so that a partial region of a bottom surface is exposed from the PCB substrate 5. The housing 13 includes an outer casing 14 and a protruding part 15. The outer casing 14 faces an internal space which houses the resonator device 1. The protruding part 15 protrudes toward the internal space from the outer casing 14 and contacts with the bottom surface of the dielectric coaxial resonator 2A which is exposed from the PCB substrate 5. The outer casing 14 and the protruding part 15 have higher thermal conductivity than that of the PCB substrate 5. |
