| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a non-contact IC card capable of preventing a damage of a non-contact IC chip when manufacturing, improving surface flatness, and preventing a damage of the non-contact IC chip when carried around.SOLUTION: An IC card 1 includes: a module base material 21 having an IC chip 22; a spacer layer 112 laminated below the module base material 21 and having pore 112a in an area corresponding to the IC chip 22; an upper layer 110 disposed on an upper side than the module base material 21; and a lower layer 130 disposed on a lower side than the module base material 21. The IC card 1 further includes: an IC chip housing part 110a obtained through applying pressure after heating each sheet until softened, so as to weld a large area having a larger contour than the module base material 21 in an area between the spacer layer 112 and the lower layer 130, and gradually incrementing the pressure applied on the upper layer 110 softened by the heating to embed the IC chip 22.</p> |
