| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of improving the controllability of a spring pressurizing force applied to a semiconductor module.SOLUTION: A screw 54 has a head part 56 and a screw part 58. The screw part 58 passes through a first through hole 12 of a semiconductor module 10 to threadedly engage with a screw hole 20 of a cooling device 18. The engagement causes the semiconductor module 10 to be fixed to the cooling device 18. A protruding part 60 made of a resin protrudes from an upper surface of the semiconductor module 10. The first through hole 12 penetrates through the protruding part 60. The protruding part 60 is inserted into a second through hole 16 of a spring 14. The head part 56 extends outward from an upper end of the protruding part 60 and is supported by the protruding part 60 to maintain a given space between itself and the upper surface of the semiconductor module 10. The spring 14 is sandwiched between the upper surface of the semiconductor module 10 and the head part 56 of the screw 54.</p> |
