| 发明名称 |
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE |
| 摘要 |
There are proposed a method and apparatus for manufacturing a chip package in which bonding wires are coupled with contact pads in which an overhang holder holds and fixes portions of a surface adjacent to portions where the contact pads are located. |
| 申请公布号 |
US2014170812(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201313846640 |
申请日期 |
2013.03.18 |
| 申请人 |
SK HYNIX INC. |
发明人 |
JOH Cheol Ho |
| 分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for manufacturing a chip package, comprising:
an overhang holder configured to hold and fix portions of a surface of a chip; and an wire capillary part configured to couple bonding wire with a respective contact pad in a state in which the portions of the surface of the chip have been fixed by the overhang holder.
|
| 地址 |
Icheon-si KR |
