| 发明名称 |
LED MODULE WITH SEPARATE HEAT-DISSIPATION AND ELECTRICAL CONDUCTION PATHS, AND RELATED HEAT DISSIPATION BOARD |
| 摘要 |
A LED module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more LED chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more LED chips; wherein inner sides of the one or more hollow regions comprise one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90-180 degrees. |
| 申请公布号 |
US2014167076(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201313836732 |
申请日期 |
2013.03.15 |
| 申请人 |
LITUP TECHNOLOGY CO. LTD. |
发明人 |
LIN Chih-Chen;LIN Tsung-I;SUNG Ying-Che |
| 分类号 |
H01L33/64;H05K7/20;F21V7/05 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A LED module with separate heat-dissipation and electrical conduction paths, comprising:
a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more LED chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more LED chips; wherein inner sides of the one or more hollow regions comprise one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90-180 degrees.
|
| 地址 |
Taoyuan County TW |
