| 摘要 |
Radio frequency system (250) which includes a first and second sub-assembly (100, 200), each formed of a plurality of layers of conductive material disposed on a substrate (102, 202) and arranged in a stack. The stacked layers form signal processing components (108, 110, 208, 210) and at least one peripheral wall (104, 204) surrounding a walled area (118, 218) of each substrate. The second sub-assembly is positioned on the first sub-assembly with a first walled area of a first substrate aligned with a second walled area of a second substrate. |
