ACTIVE FEEDBACK SILICON FAILURE ANALYSIS DIE TEMPERATURE CONTROL SYSTEM

摘要

Fault analysis of high power integrated circuits face thermal management challenges. This invention employs thermal diodes incorporated in the device undergoing fault analysis, and a closed loop microprocessor controlled feedback system for thermal control during test and fault analysis.

主权项

1. An integrated circuit test handler for a device undergoing failure analysis having at least one thermal diode comprising:
a device under test board adapted to receive a integrated circuit for test; an electrical connector for coupling to said at least one thermal diode on the integrated circuit; a microcontroller connected to said electrical connector programmed to
compare a temperature corresponding to signals from the at least one thermal diode on the integrated circuit to a temperature set point thereby generating an error signal, andcompute a solenoid drive signal from said error signal; a source of cooling fluid; a valve coupled to the source of cooling fluid, said valve having an open state supplying cooling fluid to bathe the integrated circuit and a closed state excluding cooling fluid from the integrated circuit; and a solenoid receiving said solenoid drive signal and controlling the open/closed state of said valve.