SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING THE SUBSTRATE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

A semiconductor package includes a package substrate, semiconductor chips adhered over the package substrate and configured to include bonding pads, one or more dummy patterns disposed at specific intervals in peripheries of the semiconductor chips, an insulating layer formed over the package substrate including the semiconductor chips and the dummy patterns so that the bonding pads are exposed, and wire patterns formed over the insulating layer and coupled with the bonding pads.

主权项

1. A substrate for a semiconductor package, comprising:
a substrate panel; semiconductor chips adhered over the substrate panel; at least one dummy pattern disposed at intervals in peripheries of the semiconductor chips; and an insulating layer formed over the substrate panel including the semiconductor chips and the dummy pattern.