| 摘要 |
The invention relates to a contact arrangement (30) for a multi-layer circuit board (1a), said circuit board (1a) having at least one inner wire (2) which is contacted via at least one cutout (10). According to the invention, at least two cutouts (10) are arranged on different sides of the at least one inner wire (2), the center axes (2) of the at least two cutouts (10) having a predefined distance (as) to a target center line (2.4) of the at least one inner wire (2). The at least two cutouts (10) expose the at least one inner wire (2) in at least two contact zones (2.1) for the purpose of contact, said contact zones being arranged on different sides of the wire (2). |
