PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHOD

摘要

A production method for a printed wiring board, comprising: a step in which a second resin layer (4) covering a conductor circuit (3) is formed upon a first resin layer (2); a step in which a water-repellent protective layer (8) is formed upon the surface (4a) of the second resin layer (4); a step in which a via hole (5) and a trench (6) are formed on the second resin layer (4), via a though hole (9) in the protective layer (8); a step in which a catalyst (10) is added to the second resin layer (4) and the catalyst (10) is adhered to the via hole (5) and the trench (6); a step in which the protective layer (8) formed upon the surface (4a) of the second resin layer (4) is peeled away; and a step in which electroless plating is used to fill plating metal inside the via hole (5) and trench (6) that have the catalyst (10) adhered therein.