发明名称 |
ADHESIVE FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME |
摘要 |
An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer. |
申请公布号 |
EP2637229(A4) |
申请公布日期 |
2014.06.18 |
申请号 |
EP20110838226 |
申请日期 |
2011.11.02 |
申请人 |
LG CHEM, LTD. |
发明人 |
YOO, HYUN JEE;CHO, YOON GYUNG;SHIM, JUNG SUP;LEE, SUK CHIN;JEONG, KWANG JIN;CHANG, SUK KY |
分类号 |
H01L51/52;C08K3/22;C08K3/34;C08K3/36;C09J7/00;C09J7/02;H05B33/04 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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