发明名称
摘要 According to one embodiment, a solid state imaging device includes an imaging unit that outputs imaging data by performing an imaging operation, a temperature sensor that outputs a diode voltage according to a diode current, and an output circuit that shares a part of a circuit with the imaging unit and outputs temperature data based on the diode voltage outputted from the temperature sensor in the same semiconductor chip.
申请公布号 JP5524101(B2) 申请公布日期 2014.06.18
申请号 JP20110019865 申请日期 2011.02.01
申请人 发明人
分类号 H04N5/369;H01L27/146;H04N5/374 主分类号 H04N5/369
代理机构 代理人
主权项
地址