LED chip packaging structure and its manufacturing method

摘要

The embodiment of the present invention provides a LED chip packaging structure, its manufacturing method, and a display device. According to the embodiment, a conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of a first electrode and electrically connected to the first electrode, a second conductive layer formed at a side of a second electrode and electrically connected to the second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without a welding gold wire for the conductive channel in a traditional LED. As a result, it is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.