发明名称 |
PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM |
摘要 |
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (a) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (a) by a wet-mode plating technique, wherein the compound (a) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer. |
申请公布号 |
EP2626448(A4) |
申请公布日期 |
2014.06.18 |
申请号 |
EP20110830583 |
申请日期 |
2011.09.30 |
申请人 |
MORI, KUNIO;SULFUR CHEMICAL INSTITUTE INCORPORATED;MEIKO ELECTRONICS CO., LTD. |
发明人 |
MATSUNO, YUSUKE;MORI, KATSUHITO;KUDO, TAKAHIRO;MICHIWAKI ,SHIGERU;MIYAWAKI, MANABU;MORI, KUNIO |
分类号 |
C23C18/20;C25D5/34;C25D5/56;H05K3/38 |
主分类号 |
C23C18/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|