| 摘要 |
Disclosed are a light emitting diode package and a method for manufacturing the same. The method for manufacturing a light emitting diode package according to an embodiment of the present invention includes the steps of: mounting multiple light emitting diode chips on a circuit board; forming a high refractive resin layer of a dome shape on the light emitting diode chips; separately forming a partition made of low refractive resin and a fluorescent layer formed on the area defined by the partition; and then attaching the fluorescent layer on the high refractive resin layer. Therefore, as multiple phosphors having no inhomogeneous color coordinates can be attached on the light emitting diode chips after the color coordinates of light passing through the separately formed fluorescent layer are inspected, a quality decrease of the light emitting diode package due to the phosphors can be prevented. Furthermore, the refractive index is varied in order of the light emitting diode chips, the high refractive resin layer, the fluorescent layer, and air, thereby preventing a decrease of light efficiency due to a refractive index difference between the light emitting diode chips and the fluorescent layer. |
