LED PACKAGE HAVING NANOPATICLE LAYER AND ITS MANUFACTURING METHOD

摘要

A method of manufacturing a light emitting diode package including a nanoparticle layer of the present invention comprises the steps of: mounting a light emitting diode chip on a substrate; forming a metallic nanoparticle layer enveloping the area of the portion on the outside of the light emitting diode chip; and forming an encapsulating material on the outside of the metal nanoparticle layer. The light emitting diode package including the nanoparticle layer of the present invention comprises: the substrate; the light emitting diode chip mounted on the substrate; the metallic nanoparticle layer enveloping the area of the portion on the outside of the light emitting diode chip; and the encapsulating material formed on the outside of the metal nanoparticle layer.