发明名称 |
MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
The present invention relates to a multilayer printed circuit board which includes an insulation resin sheet and a manufacturing method thereof. The insulation resin sheet includes a prepreg and an insulation resin layer which is formed on one side of the prepreg and is able to form an illuminance by a desmear process. The insulation resin layer includes: (a) a polyphenylene ether modified resin which is obtained by redistributing polyphenylene under the existence of 9,9-bis (hydroxy-aryl)-fluorene (BCF); (b) an epoxy resin; (c) a hardener; (d) modified epoxy resins of one or more types which are selected from a group which is formed with a dimeric acids modified epoxy resin and an urethane modified epoxy resin; and (e) an insulation resin sheet which is formed by hardening a thermosetting resin composition which includes a flame retardant. The present invention is able to provide a build-up printed circuit board which is able to form a high density microcircuit pattern while not only reducing a whole laminated thickness but also lowering an interlayer thermal expansion coefficient. |
申请公布号 |
KR20140074699(A) |
申请公布日期 |
2014.06.18 |
申请号 |
KR20120142950 |
申请日期 |
2012.12.10 |
申请人 |
DOOSAN CORPORATION |
发明人 |
PARK, KWANG SEOK;JUNG, SOO IM;KIM, HYUNG KYU;KIM, IN WOOK |
分类号 |
H05K3/46;H05K1/03 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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