| 摘要 |
A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer (W). The polishing apparatus includes a holding section (20) configured to hold the workpiece, a polishing head (42) configured to bring the polishing tape (41) into contact with the workpiece, a supply reel (45a) configured to supply the polishing tape to the polishing head, a rewind reel (45b) configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point. |
