LOCATING SUB-RESOLUTION ASSIST FEATURES IN SEMICONDUCTOR DEVICE FABRICATION

摘要

A method of operating a computing system to determine reticle data. The reticle data is for completing a reticle for use in projecting an image to a semiconductor wafer. The method receives circuit design layer data comprising a desired circuit layer layout, and the layout comprises a plurality of lines. The method also identifies in the plurality of lines a first line portion for use as a first circuit function and a second line portion for use as a second circuit function that differs from the first circuit function. The first line portion is parallel and adjacent to the second line portion. The method also provides the reticle data in an output data file for use in forming features on the reticle. The method also indicates parameters for forming first and second primary features as well as at least one assist feature on the reticle having an area between the first primary feature and the second primary feature, wherein in use of the reticle for use in projecting the image to the semiconductor wafer the area will favor greater assistance to the first primary feature as compared to the second primary feature.