发明名称 |
Stacked-chip packages in package-on-package apparatus,methods of assembling same, and systems containing same |
摘要 |
A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer. |
申请公布号 |
GB2483181(B) |
申请公布日期 |
2014.06.18 |
申请号 |
GB20110019498 |
申请日期 |
2010.05.04 |
申请人 |
INTEL CORPORATION |
发明人 |
SRIRAM MUTHUKUMAR;CHARLES E GEALER |
分类号 |
H01L25/065;H01L21/98 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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