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发明名称
Verfahren zur Festlegung kleiner Abstandsgroessen von Schichten unterschiedlichen Leitungstyps in Halbleiterkoerpern beim Einlegieren
摘要
申请公布号
DE1058159(B)
申请公布日期
1959.05.27
申请号
DE1955S055813
申请日期
1955.08.16
申请人
SIEMENS & HALSKE AKTIENGESELLSCHAFT
发明人
SIEBERTZ DR. KARL;HENKER DR. HEINZ
分类号
H01L21/00;H01L21/24
主分类号
H01L21/00
代理机构
代理人
主权项
地址
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