METHOD FOR CUTTING SUBSTRATE

摘要

The present invention relates to a method for cutting a substrate which includes a Bessel beam forming step, a radiation step, and a transferring step. In the Bessel beam forming step, a laser beam having Gaussian energy distribution is formed into Bessel beam having a length of no less than the thickness of the substrate to be cut and a spot size of no greater than 10μm. In the radiation step, Bessel beam is radiated on the substrate to place the substrate within the extent of length of the Bessel beam. In the transferring step, the substrate or Bessel beam is horizontally transferred along the cutting line of the substrate.