| 摘要 |
<p>The method involves providing a ceiling element having lower liquid circuits (20,20') for exchanging heat with a space. Thermally insulated upper liquid circuits (14,14') of ceiling element are arranged above the lower liquid circuit for exchanging heat with a ceiling. A heat transfer medium flowed through upper liquid circuit is guided to a return portion (19) for heating or cooling the ceiling during a charging phase. The heat transfer medium is conducted successively by upper and lower liquid circuits for heating or cooling of space during a discharge phase. An independent claim is included for the heating and cooling ceiling.</p> |
