DICING TAPE INTEGRATED ADHESIVE SHEET, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING DICING TAPE INTEGRATED ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE

摘要

The objective of the present invention is to provide a dicing tape integrated adhesive sheet which prevents a circuit on a semiconductor chip from being damaged. To solve the objective of the present invention, the dicing tape integrated adhesive sheet includes a dicing tape in which an adhesive layer is laminated on a substrate and an adhesive sheet which is formed on the adhesive layer. In a peeling test with a peeling rate of 10m/min and a peeling angle of at 150 degrees, the peeling force of the adhesive layer and the adhesive sheet is 0.02 to 0.5N/20mm. The absolute value of peeling electrification voltage is 0.5kV or less when the adhesive layer and the adhesive sheet are peeled off according to the conditions of the peeling test.