| 摘要 |
<p>Disclosed is a heat-resistant polyimide produced by polymerizing (1) pyromellitic dianhydride (PMDA), (2) a carboxylic dianhydride component comprising biphenyltetracarboxylic dianhydride (BPDA) or benzophenonetetracarboxylic dianhydride (BTDA), (3) diaminodiphenyl ether (DADE), and (4) bis(3-amino-4-hydroxyphenyl)sulfone (HOABSO2). The polyimide has excellent heat resistance and is soluble in an organic solvent. Also disclosed is a process for producing the polyimide.</p> |
