| 摘要 |
Embodiments of a system, a device, and a method for minimizing the distortion of an ultrathin IC packaged product are generally described in the present specification. According to some embodiments, an apparatus includes an IC mounted on a package substrate, and a capacitive stiffening member subassembly mounted on the package substrate. The capacitive stiffening member subassembly includes capacitive elements which are electrically connected to contact points of the IC. |
