发明名称 MEMS device with simplified electrical conducting paths
摘要 A MEMS device comprises a substrate for manufacturing a moving MEMS component is divided into two electrically isolated conducting regions to allow the moving MEMS component and a circuit disposed on its surface to connect electrically with another substrate below respectively through their corresponding conducting regions, thereby the electrical conducting paths and manufacturing process can be simplified.
申请公布号 US8754529(B2) 申请公布日期 2014.06.17
申请号 US201213401075 申请日期 2012.02.21
申请人 Miradia, Inc. 发明人 Chien Yu-Hao;Wu Hua-Shu;Chung Shih-Yung;Tseng Li-Tien;Yeh Yu-Te
分类号 H01L23/48;H01L21/50 主分类号 H01L23/48
代理机构 Rosenberg, Klein & Lee 代理人 Rosenberg, Klein & Lee
主权项 1. A MEMS device comprising: a first substrate comprising at least a first circuit disposed on a surface of the first substrate; a second substrate having a first surface and a second surface, the second substrate comprising: a MEMS component divided from the second substrate, disposed on the surface of the first substrate with the first surface facing towards the first substrate, and electrically connected with the first circuit;a conducting part divided from the second substrate, electrically isolated from the MEMS component, and electrically connected with the first circuit; anda second circuit disposed on the second surface of the MEMS component, electrically isolated from the MEMS component, and electrically connected with the first circuit via the conducting part; a third substrate having a recessed region and a plurality of standoff structures, disposed over the second substrate, and connecting to the first substrate with the standoff structures such that the second substrate is enclosed in the recessed region.
地址 Santa Clara CA US