| 发明名称 | Polyimide precursor composition, use thereof and production method thereof | ||
| 摘要 | An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure. | ||
| 申请公布号 | US8754186(B2) | 申请公布日期 | 2014.06.17 |
| 申请号 | US200712521205 | 申请日期 | 2007.12.19 |
| 申请人 | Kaneka Corporation | 发明人 | Fujihara Kan;Kogiso Tetsuya;Sekito Yoshihide |
| 分类号 | C08G69/26 | 主分类号 | C08G69/26 |
| 代理机构 | Hamre, Schumann, Mueller & Larson, P.C. | 代理人 | Hamre, Schumann, Mueller & Larson, P.C. |
| 主权项 | 1. A polyimide precursor composition comprising: at least an imidized tetracarboxylic acid represented by formula (1) below:wherein Rs each independently represent a tetravalent organic group, R′s each independently represent a divalent organic group, and 1 represents an integer of 0 to 20; and a diamine represented by formula (2) below: H2N—R″—NH2 formula (2),wherein R″ represents a divalent organic group. | ||
| 地址 | Osaka JP | ||