Extrusion process for manufacturing a Z-directed component for a printed circuit board

摘要

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

主权项

1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
extruding a substrate material through an extrusion die having a chamber defining the shape of the extruded substrate material including forming at least one channel through the substrate material with a corresponding projection in the extrusion die; dividing the extruded substrate material into a plurality of layers of the Z-directed component according to the thickness of each layer; applying a conductive material to a surface of at least one of the layers; and combining a stack of the layers to form the Z-directed component.