发明名称 Curable organopolysiloxane composition and semiconductor device
摘要 A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.
申请公布号 KR101408711(B1) 申请公布日期 2014.06.17
申请号 KR20097003829 申请日期 2007.07.24
申请人 发明人
分类号 C08L83/04;C08L83/07;H01L27/32;H01L33/56 主分类号 C08L83/04
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