| 发明名称 | Heat sink for electrical power converter | ||
| 摘要 | In order to prevent an increase in temperature of a discharge resistance discharging an electric charge accumulated in a smoothing capacitor, the present description discloses a power module. The power module has a first lead frame, a second lead frame, first and second semiconductor switches connected in series between the first lead frame and the second lead frame, a resistor connected between the first lead frame and the second lead frame, and a resin package that encapsulates the first lead frame, the second lead frame, the first semiconductor switch, the second semiconductor switch, and the resistor. In this power module, a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package. | ||
| 申请公布号 | US8754511(B2) | 申请公布日期 | 2014.06.17 |
| 申请号 | US201213542839 | 申请日期 | 2012.07.06 |
| 申请人 | Toyota Jidosha Kabushiki Kaisha | 发明人 | Atsumi Takashi |
| 分类号 | H01L23/495;H05K5/02;H01L21/00;H01L23/64;H01L23/433 | 主分类号 | H01L23/495 |
| 代理机构 | Finnegan, Henderson, Farabow, Garrett & Dunner, LLP | 代理人 | Finnegan, Henderson, Farabow, Garrett & Dunner, LLP |
| 主权项 | 1. A power module, comprising: a first lead frame; a second lead frame; first and second semiconductor switches connected in series between the first lead frame and the second lead frame; a resistor connected between the first lead frame and the second lead frame; and a resin package that encapsulates the first lead frame, the second lead frame, the first semiconductor switch, the second semiconductor switch, and the resistor, wherein a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package. | ||
| 地址 | Toyota-shi, Aichi-ken JP | ||