Wafer-level interconnect for high mechanical reliability applications

摘要

An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.

主权项

1. An interconnect structure positioned between two electrical contacts including a first metal contact and a second metal contact, the interconnect structure comprising:
a solder alloy comprising nickel (Ni) and tin (Sn), wherein the nickel (Ni) is in a range of 0.01 to 0.20 percent by weight (wt %); and an intermetallic compound (IMC) layer having a top surface in contact with the solder alloy and a bottom surface in contact with the first metal contact, the IMC layer comprising a compound of copper and nickel.