Apparatus for cleaning of circuit substrates

摘要

Silicon wafers and the like are cleaned using new scrubber-type apparatus in which measures are taken to compensate for differential cleaning of the central region of the wafer by: using rotary brushes having one or more non-contact portions arranged in the section thereof that faces the central region of the substrate, or toggling the relative position of the wafer and the rotary brushes, or directing cleaning fluid(s) preferentially towards the central region of the wafer. Another aspect of the invention provides scrubber-type cleaning apparatus in which the rotary brushes are replaced by rollers (110). A web of cleaning material (116) is interposed between each roller and the substrate. Various different webs of cleaning material may be used, e.g. a length of tissue, a continuous loop of cleaning material whose surface is reconditioned on each cleaning pass, adhesive material provided on a carrier tape, etc.

主权项

1. A circuit substrate cleaning apparatus comprising:
a pair of elongate rollers arranged such that curved surfaces thereof oppose each other across a gap, each roller being rotatable about its longitudinal axis and the outer curved surface of each roller being adapted for cleaning; and circuit substrate support means for supporting and rotating a circuit substrate between, and in contact with, the rollers, the circuit substrate support comprising at least four pair of capstans, each capstan of each pair of capstans being movable between a first position in contact with the edge of the circuit substrate and a second position spaced apart from each other by a distance sufficient to pass around the pair of elongated rollers, at least two pairs of capstans of the plurality of pairs of capstans concurrently in contact with the circuit substrate when the pair of elongated rollers is in contact with the circuit substrate; characterized by comprising compensating means adapted to reduce inequalities in cleaning across a radial direction of the circuit substrate; wherein the compensating means comprises means for moving the circuit substrate relative to the rollers in the radial direction of the circuit substrate while the circuit substrate is being supported and rotated between the rollers.