| 摘要 |
The present invention relates to a device for controlling a cutting and polishing machine which cuts or polishes workpieces positioned on a surface plate. The device for controlling a cutting and polishing machine comprises an image photographing part for photographing workpieces positioned on a surface plate to be cut or polished, and a control part for calculating the position of first and second pattern marks based on the lateral and vertical lengths of the first pattern mark inputted according as a user manipulates a key and drawn on the workpieces in a workpiece image photographed by the image photographing part and the lateral and vertical lengths of the second pattern located at a position diagonally facing the first pattern mark, obtaining the distortion angle of the workpieces by calculating a difference value between an angle of a line connecting the first and second pattern marks at the calculated positions and a set reference angle, and controlling the cutting and polishing machine for workpieces in a normal line at the distortion angle of the workpieces obtained on the first pattern mark as a machining standard. The present invention can precisely machine the workpieces by correcting the distortion of the workpieces (Ex. glass) caused by the abrasion of an align pin and the size difference of the workpieces. Also, the present invention can machine the pattern marks not only on one surface where the patterns are drawn, but also on the other surface where the pattern marks are not drawn by setting a focus on the center point of the pattern marks. |
