| 摘要 |
The present invention provides a PCB module for a junction box including a lower case formed to be connected to a junction box; a PCB substrate including a heating unit which is mounted on the lower case and generates heat, a pattern unit with a pattern, a heat absorption unit which absorbs the heat generated in the heating unit, and an insulation unit which is disposed between the pattern unit and the heat absorption unit to separate the pattern formed on the upper part and the lower part of the pattern unit; and an upper case protecting the PCB substrate by being coupled to the upper part of the lower case. By the above configuration, the heat can be effectively discharged and an additional component can be mounted on the junction box. Also, the PCB module can be applied to a high-capacity system and the weight and costs can be reduced. |
