Thermal interposer liquid cooling system

摘要

A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

主权项

1. A cold plate assembly for a heat-generating electronic component, comprising:
a thermally conducting body configured to be thermally coupled to the heat-generating electronic component such that a first surface of the thermally conducting body is in thermal contact with a surface of the electronic component, and wherein the thermally conducting body comprises at least one of microchannels to pass a cooling liquid therethrough and features configured to improve heat transfer from the thermally conducting body to the cooling liquid; and a fluid circulation body, comprising an inlet adapted to receive the cooling liquid into the fluid circulation body, and an outlet adapted to discharge the cooling liquid from the fluid circulation body.