Image sensing device including through vias electrically connecting imaging lens unit to image sensors

摘要

According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels, and an imaging lens unit arranged on the transparent substrate.

主权项

1. A solid state image sensing device comprising:
a semiconductor substrate on which a plurality of pixels are arranged; a transparent substrate including a first hole therein and including a first through via provided in the first hole; an adhesive including a second hole therein, including a second through via provided in the second hole and connected to the first through via, and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels; an imaging lens unit arranged on the transparent substrate; a back redistribution layer arranged on a lower surface of the semiconductor substrate; and a third through via electrically connected to the first through via, the second through via, and the back redistribution layer.