发明名称 Backlight module and method for coating a thermal conducting material on the backlight module
摘要 The present invention proposes a backlight module which includes a back frame and at least one light bar. The back frame is coated with a specific thermal conducting material. The thermal conducting material may form various shapes on the back frame according to locations where the at least one light bar is disposed. Thermal energy produced by the at least one light bar is escaped via the thermal conducting material with various shapes, so that temperature can be uniform across the back frame.
申请公布号 US8752997(B2) 申请公布日期 2014.06.17
申请号 US201113260325 申请日期 2011.05.11
申请人 Shenzhen China Star Optoelectronics Technology Co., Ltd. 发明人 Huang Jianfa
分类号 F21V7/04 主分类号 F21V7/04
代理机构 代理人 Friedman Mark M.
主权项 1. A backlight module, comprising: a back frame, the back frame including a flat plate and comprising a first side and a second side which are opposite sides of the back frame; and a first light bar, disposed on the first side of the back frame, comprising a first substrate and a plurality of light-emitting diodes electrically connected to the first substrate for emitting light; wherein the flat plate of the back frame is coated with a thermal conducting material for dissipating thermal energy produced by the plurality of light-emitting diodes, the thermal conducting material is coated on a first coating area on the back frame, the first coating area is an enclosed area formed by a first curve and a first straight line, the first straight line of the first coating area is located at the first side, and the periphery of the first curve of the first coating area protrudes toward the second side.
地址 Shenzhen CN